Dow Corning has introduced a new coatable thermal pad for LED lighting applications for more cost-effective thermal management. According to the introduction, this new material will allow LED luminaires and luminaire manufacturers to quickly and accurately print controlled thicknesses of thermally conductive silicon compounds on complex shaped substrates while ensuring excellent thermal management properties and helping to reduce manufacturing costs.
According to Hugoda Silva, global industry director for LED lighting, the new thermal pad offers superior design and manufacturing flexibility and lowers processing costs compared to traditional soldered thermal materials.
By reducing the amount of waste (one of the common problems with traditional thermal pads is high waste), improving thermal performance and shortening manufacturing cycles, this new technology can potentially reduce the cost of thermal pad materials by 30 to 60. It is reported that manufacturers can use standards. The screen printing or stenciling process, standard dispensing equipment to apply this material, and this material can easily adapt to complex, irregularly shaped substrates. In addition, the material can be cured in place, giving manufacturers greater flexibility in deposit thickness.
Dow Corning's coatable thermal pads are available in four grade options, distinguished by different thermal conductivity with a controlled/uncontrollable bond layer thickness. Among them, TC-4015 and TC-4016 coatable thermal pads provide 1.5W/mK thermal conductivity, TC-4025 and TC-4026 provide 2.5W/mK thermal conductivity, and TC-4016 and TC-4026 The two grades also incorporate glass beads to improve bond layer thickness control. According to the company, the new product series has a good bonding effect with ordinary lighting substrates such as aluminum and printed circuit boards. Coupled with the elimination of fiberglass pallets for traditional solder pads, this new solution offers lower thermal resistance, excellent compression ratio and consistently reliable thermal management during the life of LED fixtures or luminaires.
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